Apple and Broadcom sign $30B US chip manufacturing deal

Apple and Broadcom signed a $30B deal to produce 15B+ chips in the US by 2031. Broadcom will invest $1.5B in Colorado, boosting US chip manufacturing and supply chains.

Apple has signed a multiyear partnership with Broadcom worth over $30 billion, marking its largest domestic manufacturing commitment to date. The agreement, which runs through 2031, centers on producing custom silicon and advanced wireless components, such as FBAR radio frequency filters, for future Apple devices. Under the deal, Broadcom will manufacture more than 15 billion chips in the United States and invest $1.5 billion to expand its Fort Collins, Colorado facility. This expansion will boost production capacity for custom silicon and support Apple's broader $600 billion US investment plan to strengthen domestic semiconductor manufacturing and supply chains. The partnership is expected to support hundreds of jobs and provide long-term supply and revenue stability for both companies. Following the announcement, Broadcom’s stock price rose, reflecting investor confidence in the collaboration’s positive impact on the US semiconductor industry.